Evaluation of the peel strength in Cu/epoxy thin film using a novel...
AbstractPurpose– The purpose of this paper is to evaluate the relationship between the Cu trace and epoxy resin and to check the validity of surface and interfacial cutting analysis system (SAICAS) by...
View ArticleExperimental study on micro-drills wear during high speed of drilling IC...
AbstractPurpose– Compared with the traditional printed circuit board (PCB) drilling process, the technology of drilling IC substrate is facing more problems, such as much smaller hole diameter, more...
View ArticleMethod development for the cyclic characterization of thin copper layers for...
AbstractPurpose– The overall aim of this research work was the improvement of the failure behavior of printed circuit boards (PCBs). In order to describe the mechanical behavior of PCBs under cyclic...
View ArticleEffects of MnSO4 on microstructure and electrical resistance properties of...
AbstractPurpose– Nickel phosphorus (Ni-P) thin-films have been electrolessly deposited in an acid-plating bath with the addition of manganese sulfate monohydrate (MSM) to achieve higher resistance for...
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